90867070
Aug 5, 2021
Semiconductors; integrated circuits; microchips; microprocessors; sensors, namely, image sensors, image signal processors, ultrasonic sensors, photodetectors, touch sensors, ambient light sensors, temperature sensors, motion sensors, infrared sensors, and sensors for determining position; semiconductor parts, namely, semiconductor packaging; semiconductor parts, namely, semiconductor chips and semiconductor lead frames; downloadable software for the operation of semiconductors, integrated circuits, microchips, microprocessors, image sensors, image signal processors, ultrasonic sensors, photodetectors, touch sensors, ambient light sensors, temperature sensors, motion sensors, infrared sensors, sensors for determining position sensors, and semiconductor parts being semiconductor chips, semiconductor lead frames, and semiconductor packaging
Electrical and Scientific Apparatuscustom manufacture of semiconductors, integrated circuits, microchips, microprocessors, image sensors, image signal processors, ultrasonic sensors, photodetectors, touch sensors, ambient light sensors, temperature sensors, motion sensors, infrared sensors, sensors for determining position, and semiconductor parts in the nature of semiconductor packaging
Treatment of Materialsdesign of semiconductors, integrated circuits, microchips, microprocessors, image sensors, image signal processors, ultrasonic sensors, photodetectors, touch sensors, ambient light sensors, temperature sensors, motion sensors, infrared sensors, sensors for determining position, and semiconductor parts in the nature of semiconductor packaging; development of software for the operation of semiconductors and semiconductor parts; providing temporary use of online nondownloadable software for the operation of semiconductors, integrated circuits, microchips, microprocessors, image sensors, image signal processors, ultrasonic sensors, photodetectors, touch sensors, ambient light sensors, temperature sensors, motion sensors, infrared sensors, sensors for determining position, and semiconductor parts in the nature of semiconductor packaging
Computer and Scientific