72219989
May 28, 1965
May 24, 1966
PLASTICIZED THERMOSETTING CHEMICAL COMPOSITION HAVING A CONDUCTIVE METAL BASE AND A BONDING CONSTITUENT SUCH AS SILVER EPOXIDE, FOR SOLDERING METAL-TO-METAL, OR METAL-TO-NONCONDUCTIVE MATERIALS IN SEMICONDUCTOR DIODES, RECTIFIERS, TRANSISTORS, AND INTEGRATED CIRCUITS
Smokers’ Articles