NLAYER

Chemicals for use in the process of producing printed circuit boards, namely, resist ink in the nature of solder mask; chemicals for use in the process of producing printed circuit boards, namely, resist ink in the nature of photoresists; chemicals for use in the process of producing printed circuit boards, namely, solder resists; chemical preparations for use in the process of producing printed circuit boards, namely, solder mask; photoresists; photosensitive resists in the nature of solder mask in the form of film for use in the process of producing printed circuit boards; photosensitive resists in the nature of photoresists in the form of film for use in the process of producing printed circuit boards; chemical coatings for use in the process of producing printed circuit boards

Paints for blocking light; paints for reflecting light; marking inks in the nature of printing inks for use in the process of producing printed circuit boards; inks for hole plugging, namely, printing inks for use in the process of producing printed circuit boards; heat-resistant paints; paints; printing inks for use in the process of producing printed circuit boards; printing ink

Electrical insulating resists, namely, electrical insulating materials in the liquid form for use in the process of producing printed circuit boards; insulating resin materials for use in the process of producing printed circuit boards; insulating resin materials for interlayer dielectric materials in the liquid form for use in the process of producing build-up boards; insulating resin materials for interlayer dielectric materials for use in the process of producing build-up boards; insulating resin materials for interlayer dielectric materials in the form of film for use in the process of producing build-up boards; insulating coating materials for use in the process of producing printed circuit boards; insulating coating materials for use in the process of producing display panels; insulating coating materials for protecting copper foil on the surface of printed circuit boards; insulating coating materials for use in the process of producing package application boards; insulating coating materials for use in the process of producing flexible printed circuit boards; insulating fillers, namely, insulating materials for protecting copper foil used with holes of printed circuit boards; electrical insulating materials for use in the process of producing printed circuit boards; semi-processed plastics