NAMICS

ADHESIVES AND CONDUCTIVE PASTES AND POWDERS FOR USE IN THE MANUFACTURE OF ELECTRONIC PARTS, DEVICES AND CIRCUITS; UNPROCESSED ARTIFICIAL RESINS IN PASTE AND SOLUTION FORM FOR USE IN THE MANUFACTURE OF ELECTRONIC PARTS, DEVICES AND CIRCUITS

SEALER COATINGS AND UNDERCOATINGS FOR USE IN THE MANUFACTURE OF ELECTRONIC PARTS, DEVICES AND CIRCUITS; VARNISHES FOR USE IN THE MANUFACTURE OF ELECTRONIC PARTS, DEVICES AND CIRCUITS

ELECTRICAL INSULATING MATERIAL, NAMELY, [SILICON] * SILICONE *, EPOXY AND EPOXY/PHENOLIC-BASED RESINS IN PELLET FORM FOR USE IN THE MANUFACTURE OF ELECTRONIC PARTS, DEVICES AND CIRCUITS