MRC

[ SPUTTERING SUBSTRATE MATERIALS SUCH AS ALUMINA IN THE FORM OF THIN PLATES, BOTH PLAIN (UNCOATED) AND METALLIZED ]

METAL SPUTTERING TARGETS AND VAPOR DEPOSITION MATERIALS IN THE FORM OF DISCS, CRYSTALS, POLYCRYSTALLINE RODS, [ FOILS, ] WIRES, SLUGS, POWDERS, BUTTONS, [ LOAVES, ] INGOTS OR CLIPS OF HIGH PURITY METALS SUCH AS ALUMINUM, COPPER, GOLD, PLATINUM, SILVER, RARE EARTHS, ALLOYS, AND COMPOUNDS AND EVAPORATION SOURCES OF TANTALUM, TUNGSTEN OR MOLYBDENUM IN THE FORM OF FILAMENTS COATED WITH THE ABOVE-LISTED VAPOR DEPOSITION MATERIALS OR EVAPORATION BOATS (I.E. SHALLOW OPEN CONTAINERS) FOR HOLDING SAID VAPOR DEPOSITION MATERIALS

SPUTTERING SYSTEMS HAVING A VACUUM DEPOSITION CHAMBER, VACUUM PUMP, HIGH VOLTAGE DC AND/OR RF POWER SUPPLY UNITS, AND CONTROLS COMBINED IN CONSOLE ARRANGEMENTS AS WELL AS COMPONENTS OF SUCH SYSTEMS INCLUDING VACUUM INTERLOCKS, VACUUM PUMPING STATIONS, AND SPUTTERING POWER SUPPLIES