MINERVA

equipment, machines, apparatus and instruments, and/or systems composed thereof, for the processing and production of semiconductor devices, thin films on semiconductor substrates or substrates, semiconductor discs and wafers, namely, processing ovens used to cure materials under controlled temperature and/or pressure, typically to remove voids and improve adhesion in applications like die attach and underfill

software, downloadable software and computer systems for execution thereof, firmware, computer operating systems, recorded computer operating programs, and/or user interfaces for controlling, monitoring, and diagnosing the operations of, and the processes in, equipment, machines, apparatus and instruments, and systems composed thereof, for the processing and production of semiconductor devices, thin films on semiconductor substrates or substrates, semiconductor discs and wafers, namely, processing ovens used to cure materials under controlled temperature and/or pressure, typically to remove voids and improve adhesion in applications like die attach and underfill