METHODE

Printed circuit board assemblies; electrical backpanels for circuit board assemblies; electrical connectors and cables; molded jacks; jack panel assemblies; fiber optic connectors and cables; optoelectronic transceivers, namely, jack plug mountings; board-to-board interconnects; cable to board interconnects; dip sockets; transistor sockets; relay sockets; molded tube sockets; bus bars; power distribution systems comprising flat metal conductors and thin film dielectric material; over-molded bus bars; over-molded bus connectors; power rails; electrical lead frame assemblies; harness and cable assemblies; heat sinks; cold plates; automotive switches; integrated console assemblies; touch input panels; touch input switches; electrical instruments for testing circuit boards; wired backplanes; cable harnesses; polymer thick film resistor and conductor pastes for electronic circuits; wire wrap systems, namely, connectors; printed circuit boards; integrated circuit panels; backplane plates; jack panel assemblies; harness assemblies; smart connectors; memory cards; harness assemblies; broadband copper transceivers; ethernet transceivers; drop point units; broadband personal delivery units; telco personal service delivery units; multiport gateway units; managed switches; battery disconnect uses; power distribution units; bypass switches; current sensors; force sensors; load sensors; torque sensors; eddy current and linear displacement position sensors; fluid level sensors; presence detection systems; integrated camera sensors; radio remote controls; RF receiver; industrial tablets; electronic control systems for machines