METHODE

printed circuits, electrical backpanels for circuit board assemblies, electrical connectors and cables, molded jacks, jack panel assemblies, fiber optic connectors and cables, and optoelectronic transceivers, in particular jack plug mountings, board-to-board and cable to board interconnects, dip sockets, transistor sockets, relay sockets, molded tube sockets, bus bars, electrical leads and harness assemblies, automotive switches, electrical instruments for testing circuit boards, wired backplanes and cable harnesses, and polymer thick film resistor and conductor pastes for electronic circuits, wire wrap systems including connectors, printed circuit boards, integrated circuit panels, backplane plates, jack panel assemblies, and harness assemblies smart connectors, memory cards, and harness assemblies and power distribution systems comprising flat metal conductors separated electrically by a thin film dielectric material