METHODE

Printed Circuits, Electrical Backpanels for Circuit Board Assemblies, Electrical Connectors, Molded Jacks and Jack Panel Assemblies, in Particular Jack Plug Mountings, Board-to-Board and Cable-to-Board Interconnects, [ Dip Sockets, ] Transistor Sockets, [ Relay Sockets, Molded Tube Sockets, ] Bus Bars, Electrical Leads and Harness Assemblies, Automotive Switches, Electrical Instruments for Testing Circuit Boards, Wired Backplanes and Cable Harnesses, and Polymer Thick Film Resistor and Conductor Pastes for Electronic Circuits, Wire Wrap Systems Comprising Connectors, Printed Circuit Boards, Integrated Circuit Panels, Backplane Plates, Jack Panel Assemblies, and Harness Assemblies; and Power Distribution Systems Comprising Flat Metal Conductors Separated Electrically by a Thin Film Dielectric Material