METHODE

Printed Circuits, Electrical Backpanels for Circuit Board Assemblies, Electrical Connectors, Molded Jacks and Jack Panel Assemblies, in Particular Jack Plug Mountings, Board-to-Board and Cable-to-Board Interconnects, Dual-in-Line Package Sockets, Transistor Sockets, Relay Sockets, Molded Tube Sockets, Bus Bars, Electrical Leads and Harness Assemblies, Automotive Switches, Circuit Board Testers, Wired Backplanes and Cable Harnesses and Polymer Thick Film Resistor and Electrical Conductor Pastes for Electronic Circuits, Wire Wrap Systems Comprising Connectors, Printed Circuit Boards, Integrated Circuit Panels, Backplane Plates, Jack Panel Assemblies, and Electrical Harness Assemblies, and Power Distribution Systems Comprising Flat Metal Electrical Conductors Separated Electrically by a Thin Film Dielectric Material