MCSS MC CHEMICAL SOLUTIONS FOR SEMICONDUCTOR

Chemicals for use in industry and science; industrial chemicals; silicon dioxide; etching solutions for silicon compounds and metal; etching gels for industrial purposes; etching agents, namely, etching mordants being acids and alkaline; surface active compounds for general use in the industrial arts, namely, as wetting, spreading, emulsifying, dispersing, penetrating, smoothing, leveling, anti-static and surface treating agents; anti-static preparations, other than for household purposes; water-soluble and electroconductive polymers, namely, polymer compositions used in the manufacture of commercial and industrial goods; water-soluble and electroconductive polymer base compositions, namely, polymer compositions used in the manufacture of commercial and industrial goods; unprocessed polymers; electroconductive polymers, namely, polymer compositions used in the manufacture of commercial and industrial goods; electroconductive polymers for electronic materials, namely, polymer compositions used in the manufacture of commercial and industrial goods; unprocessed plastics; photosensitive polymers for photoresist materials; photoresists; silicon dioxide powders; industrial chemicals made from SiO2; etchants for use in the manufacture of semiconductors; hydrochloric acid; nitric acid; ammonia water; sulfuric acid; hydrogen peroxide for industrial purposes; detergents for use in manufacturing processes; detergents for semiconductor wafers for use in semiconductor manufacturing processes; unprocessed plastics containing carbon nanotube; unprocessed polycarbonate resins containing carbon nanotube

Non-metallic minerals for building or construction; quartz

Repair or maintenance of electronic machines and apparatus; repair or maintenance of integrated circuits manufacturing machines and systems; repair or maintenance of semiconductor manufacturing machines and systems; repair and maintenance of vacuum pumps; cleaning of metals; cleaning of semiconductors; cleaning of semiconductor wafers; cleaning of ceramics; applying of resin coating for others; applying protective, wear-resistant, insulative, chemical resistant, low dust attracting and plasma resistant coatings to glass and quartz; applying protective, wear-resistant, insulative, chemical resistant, low dust attracting and plasma resistant coatings to metal components, in particular the surfaces thereof; applying protective, wear-resistant, insulative, chemical resistant, low dust attracting and plasma resistant coatings to plastic components, in particular the surfaces thereof; applying protective, wear-resistant, insulative, chemical resistant, low dust attracting and plasma resistant coatings to ceramic components, in particular the surfaces thereof; applying protective, wear-resistant, insulative, chemical resistant, low dust attracting and plasma resistant coatings to glass components, in particular the surfaces thereof; applying protective, wear-resistant, insulative, chemical resistant, low dust attracting and plasma resistant coatings to metal; applying protective, wear-resistant, insulative, chemical resistant, low dust attracting and plasma resistant coatings to metal surfaces; applying protective, wear-resistant, insulative, chemical resistant, low dust attracting and plasma resistant coatings to plastics; applying protective, wear-resistant, insulative, chemical resistant, low dust attracting and plasma resistant coatings to plastic surfaces; applying protective, wear-resistant, insulative, chemical resistant, low dust attracting and plasma resistant coatings to ceramics; applying protective, wear-resistant, insulative, chemical resistant, low dust attracting and plasma resistant coatings to ceramic surfaces

Treatment of metals; treatment of surfaces of metals; processing of semiconductors; processing of semiconductors in the nature of treatment of semiconductors; manufacturing processing of semiconductor wafers; processing of semiconductor wafers; processing of semiconductor wafers in the nature of treatment of semiconductor wafers; custom assembling of semiconductors and integrated circuits; custom manufacturing and assembling of semiconductors, wafers and integrated circuits; processing of alumite; grinding; abrasive blasting services; sand blasting services; shot blasting services; grit blasting services; dry ice blasting services; processing of quartz; nickel plating; treatment of metal materials; treatment of plastic materials; treatment of ceramic materials; heat treatment and coating of surfaces of high-vacuum installations, handling systems, including steppers for semiconductor manufacturing, and components for the aforesaid installations and systems, the aforesaid installations and systems in particular for the manufacture of semiconductors and semiconductor elements; heat treatment and coating of surfaces of high-vacuum installations and handling systems including steppers for semiconductor manufacturing; heat treatment and coating of surfaces of components for high-vacuum installations and handling systems including steppers for semiconductor manufacturing; heat treatment and coating of surfaces of high-vacuum installations and handling systems in particular for the manufacture of semiconductors and semiconductor elements; heat treatment and coating of surfaces of components for high-vacuum installations and handling systems in particular for the manufacture of semiconductors and semiconductor elements; processing of plastic resins; processing of artificial and epoxy resins; processing of synthetic plastic resins; custom processing in the nature of treatment of synthetic resins and metals; recycling of silicon wafers; recycling of used parts for use in semiconductor manufacturing processes; metal plating; electroplating; electroless plating; electroplating of wafers; electroless plating of wafers; assembly of metal products for others; providing thermal spraying treatment services for treating the surface of semiconductor manufacturing and processing equipment and the internal parts in order to form a coating over surface of the equipment and the internal parts during the semiconductor manufacturing and processing under customer consignment and specifications

Materials testing and analysis, quality control inspection, and research on metals; testing and analysis and evaluation of semiconductor wafers; research and development of plating methods; research and development services relating to solar cells and electricity generation