MASSBOND

MACHINES AND TOOLS FOR PRODUCING MICRO-ELECTRONIC ASSEMBLIES OF ONE OR MORE ELECTRONIC COMPONENTS-NAMELY, INNER AND OUTER LEAD BONDING MACHINES; TOOL SLIDE ASSEMBLIES FOR POSITIONING THE WORK; INNER LEAD BONDER TOOLING; MICROVIDEO ALIGNMENT APPARATUS; THERMODES, BONDING TIPS PULSE REFLOW BONDING APPARATUS AND TOOLING; MECHANICAL HANDLING APPARATUS FOR TESTING SEMI-CONDUCTOR DEVICES ON TAPE; ISOLATION PUNCHES; TAPE CODING PUNCHES; BURN-IN FIXTURES; PRECISION TAPE EXCISOR; PUNCH, DIE AND PRESSURE PADS; PRECISION LEAD FORMING TOOLS; PRECISION LEAD FORMING TOOL INSERTS; AND X-Y-0-Z HEATED BASES