LPKF LASER & ELECTRONICS

[ Unprocessed plastics; Granules and additives for processing with plastics, namely, unprocessed plastic in the form of granules, chemical additives for plastics ]

Laser-based welding and soldering equipment and apparatus, namely, laser welding machines [ and electric powered soldering irons ]; Laser-welding apparatus being laser welders and machines; Laser-beam processing apparatus being laser optical components for surface hardening, coating, sintering, cutting, engraving, welding, soldering, microsoldering, printing, scribing, and heat treatment of workpieces and installations in the nature of laser processing units sold as a unit therewith as apparatus for laser welding, hardening, coating, laser sintering, cutting, engraving, welding, soldering, microsoldering, printing, scribing and heat treatment; Machines and electronically-controllable mechanically operated apparatus being printed circuit board milling machines for processing electric circuit carriers, namely, stencils and masks; Mechanical and laser milling-drilling machines and electronically-controllable milling-drilling equipment for use in manufacturing electric circuit boards; Machines and mechanically operated apparatus being solder tools in the nature of electric soldering apparatus; Machines and electronically-controllable mechanically operated apparatus being assembly and soldering systems comprised of machines for laser engraving, welding, hardening, coating, laser sintering, cutting, engraving, soldering, microsoldering, printing, scribing for making electric contact with circuit carriers and components; Machines and electronically-controllable mechanically operated apparatus being printed circuit board laser etching systems comprised of laser engraving and welding machines and printed circuit board milling machines for laser or mechanical processing of various substrates and substrate materials and electronic circuit boards; Machines and mechanical equipment being micro-material processors for micro processing; Mechanical tools being machine tools for the aforesaid machines and equipment; Parts for the aforesaid apparatus and equipment, sold as a unit therewith; Laser-beam plastic welding apparatus being laser welders and installations in the nature of laser welding systems comprised of laser engraving and welding machines; Laser-beam micro-welding apparatus being laser welders and installations in the nature of laser welding systems comprised of laser engraving and welding machines

Process diagnostics being process monitoring units comprised of electronic and mechanic components for laser-beam processing and installations in the nature of process control units; Electrical circuit boards; Electronic processing and controlling components for electronic components, computers, optical receivers, digital transmitters, electronic data loggers; Lasers, not for medical purposes; Laser equipment for micro processing and parts for this equipment sold as a unit therewith; Machine-readable data carriers featuring computer programs for controlling laser welding and soldering machines and equipment, sold as a unit therewith; Computer programs for operation of control technology for use with laser welding and soldering machines and equipment; computer programs for operation of regulating technology for use with laser welding and soldering machines and equipment; computer programs for controlling laser welding and soldering machines and equipment and machine-readable data carriers provided with laser welders

Laser cutting stencils for attachment to machines and mechanically operated apparatus of different types

Laser scribing of ceramic substrates, plastics, glass, silicium, and glass-reinforced epoxy laminate sheets; Material treatment, namely, laser structuring of analog and digital printed circuit boards, wavers, solar modules and microwave applications; Soldering; Manufacture of micro parts of inorganic and organic material, plastic parts and metal parts to order and/or specification of others by laser machining of materials; Treatment of materials, namely, welding by means of laser beams; Welding; Laser structuring in the nature of laser processing of electronic and electric components, circuit boards, materials and circuit carriers; Processing of plastics

Preparation of data processing programmes, namely, development of data processing programs by order of third parties; Research in the field of laser welding technology; Technical consultancy, design and development in the field of laser technology; Technological investigations in the nature of research and testing services in the field of material processing using laser technology and mechanical processing equipment, for others