LEAP

Semiconductor manufacturing machines, namely, semiconductor assembly equipment in the nature of automated die attach equipment, automated die sorting equipment, and automated die bonding equipment; Semiconductor manufacturing machines, namely, flip chip bonding machines, flip chip placement machines, and die attach machines; Semiconductor wafer processing machines; Semiconductor manufacturing machines, namely, electronic assembly manufacturing machines

Adhesive tape for industrial and commercial use, namely, adhesive tape for use in the transfer of electronic components in connection with semiconductor assembly equipment