LEAP

Semiconductor manufacturing machines, namely, semiconductor assembly equipment in the nature of automated die attach equipment, automated die sorting equipment, and automated die bonding equipment; Semiconductor manufacturing machines, namely, flip chip bonding machines, flip chip placement machines, and die attach machines; Semiconductor wafer processing machines; Semiconductor manufacturing machines, namely, electronic assembly manufacturing machines

adhesive tape for industrial and commercial use, namely, semiconductor assembly and semiconductor packaging equipment adhesive tape; adhesive tape for industrial use