LEADING THE PACK

Integrated circuit chips; microwave generating devices for industrial use, namely, microwave integrated circuits; transistors; diodes; semiconductor devices; semiconductor chips; semiconductor wafers, namely, silicon semiconductor wafers, silicon carbide semiconductor wafers, and gallium nitride semiconductor wafers; radio frequency (RF) devices, namely, packaged monolithic microwave integrated circuits (MMIC), packaged discrete transistors, semiconductor devices in the nature of MMIC bare die, discrete broadband die, and discrete bare die; power transistor switching devices; power supplies; electric switches, electric controllers; electric circuitry, namely, electric circuits, electric circuit closers, electric circuit openers, electric circuit switches, and power modules

Customized materials assembly for others; manufacture of radio frequency in microwave devices and components, namely, packaged monolithic microwave integrated circuits (MMIC), packaged discrete transistors, MMIC bare die, discrete broadband die, discrete bare die for others; manufacture of transistors for others; manufacture of wireless communication components; manufacture of amplifiers for others; manufacture of lateral diffused metal oxide semiconductors (LDMOS) for others; manufacture of metal semiconductor field effect transistors (MESFETS) for others; manufacture of components formatted for the worldwide interoperability for microwave access standard for others; manufacturing services for others in the field of semiconductor devices; providing semiconductor material treatment information; technical support services, namely, providing technical advice related to the manufacture of semiconductor materials and devices

Testing of semiconductor materials and devices, namely, silicon carbide and gallium nitride power and wireless systems; technical project research of semiconductor materials and devices, namely, silicon carbide and gallium nitride power and wireless systems; research and development of semiconductor materials and devices, namely, silicon carbide and gallium nitride power and wireless systems for others; engineering service in the field of semiconductor materials and devices, namely, silicon carbide and gallium nitride power and wireless systems; design of radio frequency and microwave devices and components in the nature of packaged monolithic microwave integrated circuits (MMIC), packaged discrete transistors, MMIC bare die, discrete broadband die, discrete bare die for others, transistors, wireless communication components, amplifiers, lateral diffused metal oxide semiconductors (LDMOS), metal semiconductor field effect transistors (MESFETS), and components formatted for the worldwide interoperability for microwave access standard; packaging design; contract foundry design, testing and engineering support services in the field of semiconductor materials and devices