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Semiconductors; integrated electronic circuits; electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators; electronic components, namely, system-in-package (SIP) modules, and multi-chip-modules (MCM) being integrated circuits; Downloadable software for use with semiconductors for opening or closing an electric circuit; Downloadable software for use with integrated electronic circuits for opening or closing an electric circuit; Downloadable software for use with electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators for opening or closing an electric circuit; Downloadable software for use with electronic components, namely, system-in-package (SIP) modules, and multi-chip-modules (MCM) for opening or closing an electric circuit; Downloadable software for use with multiple industries, namely, next generation 5G mobile networks, industrial IoT markets, battery management, home automation, electronic vehicles and medical instrumentation for opening or closing an electric circuit

Semiconductor and integrated circuit foundry services, namely, manufacturing services for others in the field of semiconductors and integrated circuits; Custom manufacturing and assembling services of semiconductor parts and integrated circuits for others; Semiconductor foundry; Processing of semiconductors; Custom assembling of circuit board and semiconductor for others; Processing of parts for semiconductor manufacturing; Processing of semiconductor elements; Processing of semiconductor wafers; Custom manufacturing of wafers, semiconductors, integrated circuits, including custom manufacturing of application-specific integrated circuit, logic chip, mixed signal chip and memory chip; Processing of wafers, semiconductors, integrated circuits, including processing of application-specific integrated circuit, logic chip, mixed signal chip and memory chip, for others; Processing and assembling services of wafers, semiconductors, integrated circuits, for others; Cutting, forming, and etching process of semiconductors and integrated circuits for others; Manufacturing services for others in the nature of encasing wafers, semiconductors, and integrated circuits in packaging

Scientific and technological services, namely, research, design, and development services of integrated electronic circuits, electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators, system-in-package (SIP) modules, and multi-chip-modules (MCM)