HYSOL

THERMOSETTING PLASTIC MATERIALS, E.G., IN THE FORM OF POWDERS AND LIQUIDS; EPOXY COMPOUNDS FOR POTTING OR PROTECTIVE COATING OF ELECTRICAL COMPONENTS; MULTI-COMPONENT THERMOSETTING RESINS FOR LOW DENSITY TOOLING AND STRUCTURAL APPLICATIONS; AND MOLDABLE SYNTHETIC CLAY-LIKE MATERIAL SETTING TO A SOLID WHICH CAN BE WORKED LIKE WOOD; RESIN BASE ADHESIVE COMPOSITIONS-NAMELY, ADHESIVE SEALANTS AND COATINGS; AND CONDUCTIVE CEMENTS AND ADHESIVE COATINGS