HYBRICON

Engineering design for others with respect to signal integrity, thermal and airflow characteristics, electronic and mechanical design layout and documentation, and electromagnetic interference modeling and simulation for electronic and mechanical components and interconnections, namely, motherboards, backplanes, electrical circuit boards, circuit boards, connectors, and enclosures, frames and racks for mounting such components; system integration of electronic and mechanical components and interconnections, namely, motherboards, backplanes, electrical circuit boards, circuit boards, connectors and enclosures, mounting frames and racks with components procured from other sources