HIGH DENSITY VIA PATTERN (HDVP)
Mark Identification

HIGH DENSITY VIA PATTERN (HDVP)

Serial Number

88771443

Filing Date

Jan 23, 2020

Trademark by

TTM TECHNOLOGIES INC.

Classification Information

Printed circuit boards; electronic back panel assemblies, namely, graphics cards, video display cards, electronic circuit cards, all for use with personal computers and personal cellular telephones; electronic wire harnesses and custom electronic cable assemblies comprised of electric connectors, electrical adapters, connection cables, cable connectors and electrical connectors; and custom electronic enclosures, namely, cases for panel mounted, electronic instruments in the nature of logic analyzers

Electrical and Scientific Apparatus

Manufacture of printed circuit boards, electronic backpanel assemblies, electronic wire harnesses, custom electronic cable assemblies, and custom electronic enclosures to order and/or specifications of others

Treatment of Materials