HICERAM CARRIER

Semiconductor manufacturing machines; parts and accessories of semiconductor manufacturing machines; laminated semiconductor chip manufacturing machines; parts and accessories of laminated semiconductor chip manufacturing machines; semiconductor manufacturing equipment components, namely, ceramic substrates for arranging and temporarily bonding semiconductor chips and forming a redistribution layer on a semiconductor substrate in the semiconductor substrate manufacturing process; semiconductor manufacturing equipment components, namely, ceramic substrates for processing and transporting semiconductor substrates in the semiconductor substrate manufacturing process semiconductor manufacturing equipment components, namely, ceramic substrates used in the process of semiconductor packaging, including fan-out wafer-level packaging (FOWLP).