HICC

Machines and machine tools for microelectronics, for the production, treatment, transport, and processing of electronic components in the fields of medical equipment techniques technology, biotechnology, microsystem techniques technology, semiconductor technology, nanotechnology, wafer bonding technology, lithography equipment technology; machines for manufacturing electronic components and optical and technical devices, namely, active and passive electronical components in the nature of micro-electromechanical systems (MEMS), microchips, memory chips, diodes, namely, light-emitting diodes, transistors, and optical lenses; precision machines as well as spare parts for the same for use with semiconductor technology, microelectronics, medical equipment, biotechnology, microsystems, and nanotechnology; self-regulating pumps, namely, resist dispense pumps

Scientific apparatus and instruments for microelectronics, for medical equipment techniques, biotechnology, microsystem techniques, semiconductor and nanotechnology, namely, exposure systems for 1X lithography applications, namely, mask aligners and contact and proximity printers and devices for joining one or multiple substrates temporarily or permanently, namely, substrate bonding systems comprised of UV-radiation/UV-light source devices, heaters, and pneumatic and hydraulic piston setups and spindles; surveying devices, electric, photographic, optical, measuring, signaling, and monitoring devices, in particular for precision systems in the semiconductor technology, in microelectronics, in medical equipment techniques, biotechnology, microsystem techniques, and nanotechnology, namely, front to backside alignment measurement systems including at least one of measurement apparatus that detects a reference pattern on both the front and on the backside of a substrate and stages that allow for moving the substrate so that the measurement apparatus can detect the pattern at the desired location of the substrate, computer hardware that can analyze the data and calculate misalignment values between the pattern on the front and backside; chips, integrated circuits; downloadable computer operation programs for use in the operation of microelectronics and semiconductor fabrication and processing apparatuses; peripheral equipment for computers; data processing units, data processing devices and computers; downloadable computer software for analyzing wafer bonding results and pattern alignment of substrates; scientific diagnosis devices in bio-chip format, namely, DNA microarrays, microfluidic chips, and protein microarrays comprising oligonucleotide-arrays, miniaturized immunologic test-arrays, substance libraries, combinatorial substance libraries on chip surfaces for scientific purposes; electric systems for remote controlled industrial operational processes, namely, laboratory robots; protective masks and filters therefor for use with photographic and photolithographic equipment and photographic film processing; devices for telecommunications, namely, telegraphic transmitting apparatus, telecopying devices, and telephones; semiconductors; capillary reagent tubes for laboratory use; electric monitoring devices, namely, oscillographs, indicators, and surveying instruments; couplers being data processing equipment; furniture especially made for laboratories; laser for non-medical purposes; reading devices being data processing apparatus; measuring instruments, namely laser measuring devices; measuring devices, namely, laser measuring devices; material testing instruments and machines, namely, machines for testing bonding strength in bonded substrates; optical apparatus and instruments, namely, microscopes; photographic apparatus and instruments, namely, cameras; physical and chemical laboratory apparatus and instruments, namely, metrology tools, debonding tools based on chemical assisted debonding; precision measuring devices for measuring wafter curvatures, wafer warpages, structural misalignments, and run-out errors; projectors, namely, digital micromirror device (DMD) based illumination devices; protective clothing, in particular for protection against accidents in clean-rooms; silicon wafers; probes for scientific purposes; spectroscopes; range finders for photographic equipment

Scientific and technological services and research and design relating thereto in the field of engineering; industrial analysis, industrial research and industrial design services in the field of engineering; design and development of computer hardware and software; scientific laboratory services; engineering; computer programming; engineering and scientific laboratory services; providing and conducting evaluations, estimates, research and reports in the scientific and technological fields, namely, analysis and metrology of coating, imprinting, embossing bonding, debonding, and alignment quality of wafers and chips; technological consultancy in the field of medical and scientific equipment; software as a service (SaaS) featuring software for metrology, namely, analyzing wafer warpage, bond quality, run-out quality, imprinting quality, and embossing quality; platform as a service (PaaS) featuring software for metrology, namely, analyzing wafer warpage, bond quality, run-out quality, imprinting quality, and embossing quality; conducting technical project studies relating to medical and scientific equipment; material testing; calibration; construction drafting; research and development of new products for others; research in the field of physics; mechanical research; engineering services for others; product development of precision systems and devices for the semiconductor technology; product development of devices for microsystem techniques, microelectronics, medical techniques, biotechnology, telecommunication, wafer bonding, lithography equipment; providing systems technology solutions for sensorics and diagnostics, in particular of biology and medicine for others; research work in the field of bio-technology; mechanical research work in the field of microsystem technology, nanotechnology, wafer bonding, lithography equipment; mechanical and scientific research work in the field of bio-sensorics and chemical sensorics; technological consulting for third parties concerning handling production plants and process equipment; research services, namely, microsystem technology and nanotechnology research services; providing temporary use of online non-downloadable computer programs for data processing