HI-PED

: integrated circuits, namely, system-in-package (SiP) electronics; micro electromechanical systems (MEMS); inertial MEMS; substrate-embedded systems; planar magnetic boards; mesh communication electronics; mmWave RF antennae PCB; antennae-in-chip (AiC); antennae-in-package (AiP); substrate-like PCB (SLP); Fan-in/Fan-out AiP (InFO-AiP); Package-in-package (PiP) electronics; integrated photonic devices; through Silicone via (TSV) devices; embedded multi-die interconnect bridge (EMIB) chips; monolithic microwave integrated circuits (MMIC); interposers; and technical manuals sold with the above goods