HGMT

Personnel management; preparing invoices; drawing up of statements of accounts.

Custom assembling of integrated circuit mask and electronic or computer chips for others; abrasion; paper finishing; stripping finishes; printing; recycling of waste and trash; encapsulation of semiconductors; processing and treatment of chemical reagents; processing of semiconductor wafer; custom 3D printing for others.

Photomask; memory modules; semiconductor memory devices; chip cards; optical glass for photomask; optical semiconductor for photomask; quartz crystal oscillators for photomasks; structured semiconductor wafers for photomask; integrated circuits for photomask; semiconductors; wafers for integrated circuits; chips [integrated circuits]; integrated circuits; semiconductor devices; sensors; films, exposed.

Research in the field of semiconductor processing technology; design of semiconductor packaging; design of semiconductor; technological research; development of circuit manufacturing technologies for wireless communications, electronic data processing, consumer electronics and automotive electronics; research and development of new products for others; design of integrated circuits; quality control; material testing; industrial design; consultancy in the design and development of computer hardware; computer software design; graphic arts design.