75406280
Dec 16, 1997
Oct 2, 2001
HEAT DISSIPATION COMPONENTS FOR COMPUTERS AND ELECTRONICS, NAMELY, HEAT SINKS FOR USE WITH MICROPROCESSORS, INTEGRATED CIRCUITS, AND APPLICATION-SPECIFIC INTEGRATED CIRCUITS (ASICS)
Electrical and Scientific ApparatusCUSTOM MANUFACTURE OF HEAT DISSIPATION COMPONENTS, HEAT DISSIPATION ASSEMBLIES, AND HEAT DISSIPATION SYSTEMS FOR OTHERS
Treatment of MaterialsENGINEERING SERVICES NAMELY, DESIGN AND ANALYSIS OF HEAT DISSIPATION COMPONENTS, HEAT DISSIPATION ASSEMBLIES AND HEAT DISSIPATION SYSTEMS FOR OTHERS
Computer and Scientific