G

Robotic arms for industrial purposes; Loading and unloading machines; Lifting installations for the transport of persons and goods; Semiconductor wafer processing equipment and components, namely, epitaxial reactors, chemical vapor deposition reactors, physical vapor deposition reactors, plasma etchers, ion implanters, supporting frames therefor, and parts thereof; Industrial machinery, namely, electromechanical marking machines; Vacuum pumps; Mechanical seals being machine parts; Axles for machines; Transmission shafts, other than for land vehicles; Industrial robots; Pumps for machines; Pumps as parts of machines, motors and engines; Heat exchangers being parts of machines; Power transmission belts for machines; Industrial chemical reactors; Plasma etching machines; Machine parts, namely, hoods; Ejectors as parts of machines; Chemical-mechanical polishing and cleaning machines; Dry semiconductor processing equipment, namely, plasma etching machines, semiconductor wafer processing equipment, single-wafer etching machines; Semiconductor processing equipment, namely, substrate baking, coating, cleaning, developing and drying machines; Chemical machines, namely, semiconductor wafer drying machines, semiconductor wafer scrubbing and washing machines; Semiconductor wafer processing machines; Etching machines used for manufacturing semiconductor wafers; Cleaning machines used for manufacturing semiconductor wafers; Semiconductor wafer cleaning and etching equipment; Semiconductor wet processing equipment; Chemical delivery equipment for semiconductor circuits and wafer processing; Machines for wet-chemical processes, in particular machines for the transportation and for wet chemical etching, cleaning, drying, surface coating, and plating processes, namely, for use in electroplating and electroless plating of semiconductor wafers, semiconductor chips, medical implants, photovoltaic wafers and photovoltaic cells; Machines, namely, installations for wet-chemical etching, wet-chemical cleaning, drying and plating, namely, electro and electroless depositions processing of different substrates, particularly semiconductor wafers, semi-conductor chips, medical implants, photovoltaic wafers, photovoltaic cells; automated transportation and measuring machines for wet-chemical processes; Component parts of machines, namely, feeders in the nature of loading and unloading machines, chucks for use in the manufacturing of semiconductor devices, molds for use in the manufacturing of semiconductor devices; Handling apparatus for loading and unloading, namely, loading and unloading machines; and Holding devices for use in the manufacturing of semiconductor devices; Machines for making computer chips and semiconductors for the chip and semiconductor industries; Semiconductor manufacturing equipment, namely, a substrate masking apparatus preferably for use with an ion implanter; Semiconductor processing and manufacturing equipment having coating, developing, and thermal treatment capabilities used for the processing and production of semiconductor substrates, thin films, photo-resist materials, silicon discs and wafers; Semiconductor manufacturing machines; Semiconductor wafer processing equipment; Semiconductor wafer processing machines; Physical vapor deposition machines and complete ion implantation machines comprised of ion sources, ion accelerators and scanners, processing chambers, vacuum systems, power supplies and controls, ion sources; Machines, machine tools and equipment, namely, semi-automatic, manual and automatic assembly machines; Machines for treatment of electronic components; Wafer frame cleaning machine; Semiconductor processing machines; Semiconductor cleaning machines; Semiconductor diagnostics, support and maintenance machines, and replacement parts for use therewith; Semiconductor substrates manufacturing machines; Semiconductor substrates processing machines; Semiconductor substrates cleaning machines; Semiconductor wafer manufacturing machines; Integrated circuit manufacturing machines; Integrated circuits processing machines; Integrated circuit cleaning machines, integrated circuit polishing machines, integrated circuit diagnostics, support and maintenance machines, and replacement parts for use therewith; Machines and precise mechanical apparatus for the production and processing of electronic, micro mechanic and optical components; Coating machines for the production and processing of electronic, micro mechanic and optical components, in particular spin coater and spray coater; Bonding devices for the production and processing of electronic, micro mechanic and optical components, namely, bonder, used for processing the connection between chip and lead frame; mask alignment apparatus for the production and processing of electronic, micro mechanic and optical components, namely, mask aligner; Apparatus for cleaning semiconductor wafers, masks, flat panels, display and other substrates, namely, scrubber and clean track scrubber; Semiconductor wafer cleaning devices for use in semiconductor wafer cleaning and etching equipment, namely, wet bench; Semiconductor wafer cleaning devices for use in chemical mechanical polishing machines for cleaning semiconductor wafers, namely, in the nature of a CMP chemical mechanical polishing sponge

Furnace used in Semiconductor Processing Equipment; Furnaces, other than for laboratory use; Furnaces