FUJIMI

abrasives and polishing agents in the form of powders, pastes, slurries, colloids, and pellets for use with silicon wafers, semiconductor crystals, compound semiconductors, quartz crystals, prisms, lenses, glass, metal, plastics and ceramics

lapping machines, polishing machines, and grinding machines, and abrasive and polishing pads, wheels and shaped solid blocks used as accessories therefor