Cleaning apparatus comprising a spray nozzle connected to a liquid carbon dioxide tank which utilizes carbon dioxide particles to clean substrates such as semiconductor or glass substrates by blowing dust particles of the substrate surface, organic matter of the substrate surface or burrs which occur during micro-process on the substrate surface while scanning the carbon dioxide particles from the spray nozzle to the substrate; Cleaning apparatus comprising a spray nozzle connected to a liquid carbon dioxide tank which utilizes carbon dioxide particles to clean products such as electronic or semiconductor products by blowing dust particles of the product surface, organic matter of the product surface or burrs which occur during micro-process on the product surface while scanning the carbon dioxide particles from the spray nozzle to the product
Machinery