FPPTH

Substrates incorporating semiconductors; glazed substrates incorporating into thermal printer heads; polyimide thin film multilayer substrates incorporating semiconductors; integrated circuit packages for semiconductors; semiconductor chip packages; electronic device packages used for crystal resonator or SAW, or Surface Acoustic Wave, filter as parts of telecommunication apparatus; leadless chip carriers; interposers for semiconductors; printed circuit boards; flexible printed circuit boards; printed wiring boards; pin grid array semiconductor chip packages; ball grid array semiconductor chip packages; semiconductor chip packages for high frequency band; ceramic packages or substrates used as a component of integrated circuit packages; cerdips, namely, ceramic packages or substrates used in the manufacture of integrated circuits; printed circuits; printed wiring; multilayer printed circuit boards