FORMION

Machines for the assembly and packaging of electronic semiconductor chips; machines for manufacturing semiconductors, and structural parts and fittings therefor; semiconductor manufacturing machines; semiconductor manufacturing machines and systems composed of a vacuum chamber for accommodating semiconductor wafers and structural parts and machines for handling and transferring semiconductor wafers into and out of vacuum chamber, and structural parts and fittings therefor; machines for the treatment of semiconductor wafers, namely, semi-conductor wafer processing equipment; industrial robots for the handling of semiconductor wafers; machines for the assembly and packaging of electronic chips; industrial chemical reactors; industrial robots; Industrial surface treatment equipment, namely, vacuum plasma treatment systems comprised of a high frequency, high voltage generator, controls, and treatment chamber; and structural parts and fittings therefor

Electrical reactors for processing semiconductor wafers; reactors for processing semiconductor wafers, namely, chemical reactors for the thermal treatment of semiconductor; electronic controllers for the semiconductor industry; electronic control systems for semiconductor manufacturing machines; laboratory chemical reactors; robots being electronic control devices, namely, laboratory robots; electronic control systems for machines; semiconductor wafer processing reactors for the chemical treatment and the thermal treatment of semiconductor wafers and for the chemical cleaning of semiconductor wafers by means of a gas phase process, also with the use of plasma, namely, gas discharge; and structural parts and fittings for the aforementioned goods