EZCOB

Integrated circuits; Semiconductor component, namely, power elements, wafers, chips, memory units; integrated circuit substrate, namely, photomask, silicon wafer for use in fabrication of integrated circuits; Printed circuit board; Alumina substrate in the nature of metal silicon wafer substrate for use in fabrication of integrated circuits; chips being integrated circuits; Semiconductor chip; Silicon chip; Microchip; Semi-conductors; Interface card for data processing equipment in the nature of printed circuits; Circuit board; integrated circuit board; Integrated circuit socket; Glass substrate in the nature of metal silicon wafer substrate for use in fabrication of integrated circuits; Semiconductor devices; Electric sensors; Video phone

Crystal wafer etching treatment; Semiconductor sealing processing; Integrated circuit etching treatment; Wafer Foundry, namely, manufacture of semiconductor wafers for others; Metal cutting treatment; Metal polishing treatment; Metal forging treatment; metal tempering; Metal rust-resistant treatment, namely, applying protective coatings to metal by means of galvanization; metal plating; cadmium plating; chromium plating; galvanization; gold plating; nickel plating; silver plating; tin plating; electroplating; laminating of metal plates, plastic sheets; metal casting; blacksmithing; Metal welding treatment; welding services; metal treating; grinding; burnishing by abrasion; refining services, namely, refining of metals