EXENSIO

Computer software for use in providing automated characterization and analysis of product chip and cell library layouts in the field of semiconductor manufacturing

Engineering and consulting services in the fields of technical support, namely, assisting users with use of the software and troubleshooting in the nature of diagnosing computer software and hardware problems, engineering know-how, and best practices for semiconductor companies; engineering and consulting services in the fields of yield, performance improvement, and productivity improvement in the manufacture test and packaging of semiconductors; cloud computing featuring an analytic software platform to access and visualize big data for decision support; platform as a service (PAAS) featuring computer software platforms for business and manufacturing data analysis and decision support