EQDC

Computer software for the input of data on machines for processing semiconductors, in particular wafer slicing machines, die bonders, wire bonders, cleaning units, curing units, packaging machines, mounting machines, assembly machines, test machines, test handlers and transport robots, the machines being connected with a host system; computer software for the input and output of data on machines for processing semiconductors, in particular wafer slicing machines, die bonders, wire bonders, cleaning units, curing units, packaging machines, mounting machines, assembly machines, test machines, test handlers and transport robots, the machines being connected with a host system; computer software for the input and, optionally, output of data on machines for processing semiconductors, in particular wafer slicing machines, die bonders, wire bonders, cleaning units, curing units, packaging machines, mounting machines, assembly machines, test machines, test handlers and transport robots, the machines being integrated in a Manufacturing Executing System environment

Conception, creation and design of computer software for others, namely, software for the input of data on machines for processing semiconductors, in particular, wafer slicing machines, die bonders, wire bonders, cleaning units, curing units, packaging machines, mounting machines, assembly machines, test machines, test handlers and transport robots, the machines being connected with a host system, and consulting services related to it