Classification Information
Wireless wafers for measuring physical conditions such as temperature, pressure, vibration, humidity, gas concentration, and electromagnetic properties within semiconductor processing equipment or environments where wafer-like objects are spun, carried, chucked, or handled by the semiconductor processing equipment; Electronic sensors embedded in wafer-like substrates for monitoring operational parameters of semiconductor processing tools, including thermal, mechanical, and environmental conditions; Data acquisition wafers featuring wireless communication modules for transmitting measurement data from semiconductor processing environments to external monitoring systems
Electrical and Scientific Apparatus