Mark Identification

DTI DTI

Serial Number

75547850

Filing Date

Sep 3, 1998

Registration Date

Jun 25, 2002

Trademark by

DAYSHINE TECHNOLOGY INC.

Classification Information

components used in packaging integrated circuits, namely, an insulated wafer and substrate material fabricated from silicon or Bismaleeimide Triazine (BT resin) laminate for use in packaging an integrated circuit chip into a plastic ball-grid array package which constitutes a part of the packaged integrated circuit

Electrical and Scientific Apparatus