DISCO

Cutting machines for semiconductor, glass and ceramic wafers; grinding machines for semiconductor, glass and ceramic wafers; polishing machines for semiconductor, glass and ceramic wafers; metalworking machines utilizing laser beams for cutting; machine tools for cutting namely, cutting blades; machine grinding tools for grinding machines; machine polishing tools for polishing machines [ ; chemical processing machines and apparatus, namely, etching machines and evaporating machines, all for chemical processing; semiconductor manufacturing machines and machine systems ]