DECAN

Metalworking machines, namely, machining centers; industrial robots; industrial robots for assembling electronic circuit; Semiconductor wafer processing machines; chip mounting machines for semiconductor processing; semiconductor assembly machine having a vision system for inspecting, placing and aligning devices comprising electronic cameras, optics, illuminators and image processing electronics; wire bonding machines for semiconductor manufacturing; mounting machines for semiconductor chip manufacturing; die bonding machines used in manufacturing microchips and semiconductors; PCB (printed circuit board) loader and unloader machines; vertical carriers loading and unloading machines; wire bonding machines used in manufacturing microchips and semiconductors; flip chip bonding machines; chip mounters, namely, mounting machines for mounting microchips, semiconductor chips, semiconductor components and electronic components; handling apparatus for loading and unloading, namely, loading and unloading machines; auto loaders of lead frames for use in semiconductor manufacturing; fluid dispensers being parts of semiconductor processing machines; machines for manufacturing semiconductors; PCB circuit coating machines; circuit board manufacturing and processing machines