DATACON DC

machines, equipment and apparatus for automated production and control of semi-conductors, namely, die bonders; multichip die bonders; dual head die bonders; flip-chip die bonders; dispensing machines; wafer mounters; seam welders; test handlers; dipping units; optoelectronic systems, namely, pattern recognition units, position recognition units and optical circuit-board test units; impulse spot welders; inspection systems, namely, population inspection units, visual surface inspection units, bump inspection machines, bond wire inspection machines, glue and solder paste inspection machines, wafer inspection machines and post bond inspection machines; fully automated welding machines for ceramic or metal packaging; automatic assembly machines for the microelectronics industry

computer hardware and computer software for controlling semi-conductor processing and manufacturing in the microelectronics industry, graphic image identification, and digital image processing; stationary and portable computers for data acquisition and processing

computer programming and software design for others