CYPRIUM

Copper paste for industrial purposes; Paste made of copper nanoparticles for use in industrial applications; Copper paste for use in electronic and semiconductor manufacturing; Copper paste used in thermal management for industrial applications; Copper-based paste for use in via filling in printed circuit boards (PCBs) for use in electronic and semiconductor manufacturing; Copper-based paste for use in integrated circuit (IC) substrate manufacturing applications, Copper-based paste for power management in printed circuit board and integrated circuit (IC) substrate manufacturing applications; Copper-based paste for use in electronic die-attach assembly applications; Copper-based paste for use in sintering materials for electronic component interconnects; Copper-based paste for use in electronic devices to manage high power thermal loads; Copper-based paste for use in electronic devices to manage conductivity and circuit resistance