CURAMIK |

THERMALLY CONDUCTING ADHESIVES ALSO IN THE FORM OF PASTES; ELECTRICALLY CONDUCTING PASTES

METAL MATRIX COMPOSITE MATERIALS AND METAL-CERAMIC COMPOSITE MATERIALS FOR MANUFACTURING USE IN THE ELECTRONIC INDUSTRY

COOLERS WITH LIQUID COOLING AGENT FOR ELECTRONIC AND ELECTRICAL MODULE UNITS, ELECTRONIC AND ELECTRICAL COMPONENTS, ELECTRONIC AND ELECTRICAL APPARATUS AND THEIR PARTS, IN PARTICULAR MICRO-CHANNEL COOLERS FOR USE IN MICROPROCESSORS, HIGH PERFORMANCE COOLERS FOR MICROPROCESSORS, COOLERS FOR PERSONAL COMPUTER HOUSINGS; COOLERS FOR LASER DIODES; THERMALLY CONDUCTING INTERFACE MATERIALS FOR THE THERMAL COUPLING OF ELECTRICAL AND ELECTRONIC COMPONENTS ON A CIRCUIT BOARD; HEAT SINKS FOR USE IN ELECTRONIC COMPONENTS; HEAT STRADDLERS FOR USE IN THE ELECTRONIC FIELD; CIRCUIT BOARDS, IN PARTICULAR CERAMIC CIRCUIT BOARDS; COPPER COATED ALUMINUM OXIDE SUBSTRATES, COPPER COATED ALUMINUM NITRIDE SUBSTRATES, COPPER-CERAMIC ALLOYS IN THE FORM OF INSULATING COMPONENTS AND INSULATING MATERIALS PROVIDED WITH CURRENT CONDUCTORS, ALL FOREGOING GOODS FOR USE IN INTEGRATED CIRCUITS