CU.P BUMP

conductive interconnect components, containing copper, on and extending from, an integrated circuit or semiconductor wafer, flip chip interconnect components, namely, flip chip on lead frames, flip chip on substrates and micro electromechanical systems; pillar bump components, namely, wafer level chips skill package and micro electromechanical systems; integrated circuit interconnect components, namely, chip on chip components for micro electromechanical systems

Custom manufacture of bumps, namely conductive material, including copper, on an integrated circuit or semiconductor wafter; custom semiconductor bumping services; custom electroplating of conductive material on integrated circuits or semiconductor wafers; custom pillar bumping services