CUFIRST

Machines for electronics assembly, particularly in the semiconductor assembly field, and specifically for die attach machines and thermocompression bonding machines and flip chip bonding machines

Processes for operating machines for electronics assembly, particularly in the semiconductor assembly field, and specifically die attach processes and thermocompression bonding processes and flip chip bonding processes

Computer controlled processes for operating machines for electronics assembly, particularly in the semiconductor assembly field, and specifically die attach processes and thermocompression bonding processes and flip chip bonding processes