COOL SHIELD

CHEMICAL COMPOUNDS FOR COMPUTER USE, NAMELY, PLASTIC MOLDING COMPOUNDS FOR USE AS THERMAL INTERFACES BETWEEN THERMAL DISSIPATING DEVICES AND HEAT GENERATING OBJECTS

Molded electromagnetic shielding devices for computer use as electrically conductive or dielectric shields to protect electromagnetic sensitive devices

THERMAL DISSIPATING DEVICES FOR COMPUTER USE, NAMELY, THERMALLY CONDUCTIVE COMPOSITE INJECTION MOLDED HEAT SINKS FOR DISSIPATING HEAT FROM HEAT GENERATING OBJECTS; AND THERMALLY CONDUCTIVE THERMOPLASTIC INTERFACE DEVICES FOR USE AS THERMAL INTERFACES BETWEEN THERMAL DISSIPATING DEVICES AND HEAT GENERATING OBJECTS