Classification Information
Solder preforms; Solder wire; Wire; Metal ribbon; Solder preforms, wire, and metal ribbons for use in the electronics industry; Metal bonding pads; Metal microstampings for use as electronic components, namely, jumper chips, bonding pads, covers, heat sinks, lead frames, tabs, and terminals; Metal stampings, namely, stamped metals and metal alloys for use in manufacture of electronics
Metal Goods