Mark Identification
C4NP
Serial Number
79014965
Filing Date
Apr 26, 2005
Registration Date
Oct 17, 2006
Trademark by
Classification Information
Machines, using solder bumping technology, for use in the manufacture of semi-conductors and microstructure elements such as wafers and glass templates used in the manufacture of semi-conductors
MachineryComputer hardware and computer software for use in the manufacture of semi-conductors and microstructure elements such as wafers and glass templates used in the manufacture of semi-conductors
Electrical and Scientific ApparatusMaintenance, repair and installation of machines for the manufacture of semi-conductors and microstructure elements such as wafers and glass templates used in the manufacture of semi-conductors
Building Construction and Repair