C-MAC

ELECTRONIC APPARATUS, INSTRUMENTS AND COMPONENTS, NAMELY, CIRCUIT BOARDS, RESISTOR NETWORKS, BATTERY FEED RESISTORS, LINE FEED RESISTORS, VIDEO FILTERS, DIGITAL AND ANALOG FILTERS, INTEGRATED CIRCUITS, HEATING ELEMENTS ON INSULATED METAL SUBSTRATES (IMS); MEASURING, TESTING, CALIBRATING, CONTROLLING AND REGULATING INSTRUMENTS AND APPARATUS, NAMELY, REGULATORS, PEAK POWER DEMAND CONTROLLERS, POWER FACTOR CONTROLLERS, TEMPERATURE CONTROLLERS, CIRCUIT ANALYZERS, POWER QUALITY ANALYZERS, GAS PRESSURE MONITORS; APPARATUS FOR SUPPLYING ELECTRIC POWER AND FOR MONITORING THE SUPPLY OF ELECTRIC POWER, NAMELY, ELECTRIC AND ELECTRONIC CONVERTERS, DC/DC (DIRECT CURRENT) CONVERTERS, POWER RESISTORS, POWER SUPPLIES AND COOLING UNITS; TEMPERATURE REGULATING APPARATUS, NAMELY, ELECTRONIC THERMOSTATS; ADJUSTING AND AUTOMATING APPARATUS AND INSTRUMENTS, NAMELY, HIGH SPEED PIN INSERTION MACHINES; CONNECTING APPARATUS, CONNECTOR ASSEMBLIES, NAMELY, ELECTRICAL AND ELECTRONIC CONNECTORS AND SYSTEM RACKS FOR TELECOMMUNICATION; DATA BUS PRODUCTS, NAMELY, 1553 AND 1760 DATA BUS CONTROLLERS, AND 3910 HIGH SPEED DATA BUS CONTROLLERS; APPARATUS FOR SUPPORTING OR MOUNTING OF CONNECTOR ASSEMBLIES OR OF ELECTRICAL AND ELECTRONIC CONNECTORS, NAMELY, BACK PLANES, CARD CAGES, SHELVES AND FRAMES, POWERED CHASSIS, AND EXTENDER BOARDS; RESISTORS, FUSES; CIRCUIT BREAKERS; ELECTRICAL CONDUCTORS; ALTERNATORS; TRANSCEIVERS; ANALOGUE AND/OR DIGITAL INTEGRATED CIRCUITS; FREQUENCY CONTROL DEVICES, NAMELY, OSCILLATORS, RESONATORS, FREQUENCY FILTERS, AND SYNTHETIC QUARTZ SUBSTRATES AND SYNTHETIC QUARTZ BLOCKS AND CRYSTALS FOR USE IN ANY OF THE AFORESAID GOODS; SURFACE ACOUSTIC WAVE DEVICES, NAMELY, SURFACE ACOUSTIC WAVE FILTERS, SURFACE ACOUSTIC WAVE OSCILLATORS, SURFACE ACOUSTIC WAVE ACCELEROMETERS; HYBRIDS, NAMELY, THICK FILM HYBRIDS, MULTI-CHIP MODULE (MCM) HYBRIDS, HYBRID FILTERS AND APPLICATION SPECIFIC HYBRID CIRCUITS

CUSTOM MANUFACTURE OF INTERCONNECT PRODUCTS, NAMELY, BACK PLANES, CARD CAGES AND SHELVES, FULL SYSTEM INTEGRATION OF BACK PLANES, SUBRACK, POWER SYSTEMS AND THERMAL MANAGEMENT, ASSEMBLED AT POINT OF USE CONNECTOR SYSTEM (APUCS), IN-LINE WAVE AND VAPOR PHASE SOLDERING AUTOMATED SOLDERED PIN AND PRESS FIT COMPLIANT PIN ASSEMBLEY, SHEET METAL AND STRUCTURAL FOAM ENCLOSURES, PRECISION INJECTING MOLDING; MOUNTING ELECTRONIC COMPONENTS ON PRINTED CIRCUIT BOARDS AND ASSEMBLING ELECTRONIC SYSTEMS

CUSTOM DESIGNING OF INTERCONNECT PRODUCTS, NAMELY, BACK PLANES, CARD CAGES AND SHELVES, FULL SYSTEM INTEGRATION OF BACK PLANES, SUBRACK, POWER SYSTEMS AND THERMAL MANAGEMENT, ASSEMBLED AT POINT OF USE CONNECTOR SYSTEM (APUCS), IN-LINE WAVE AND VAPOR PHASE SOLDERING AUTOMATED SOLDERED PIN AND PRESS FIT COMPLIANT PIN ASSEMBLY, SHEET METAL AND STRUCTURAL FOAM ENCLOSURES, PRECISION INJECTING MOLDING; TECHNICAL SUPERVISION AND/OR INSPECTION IN THE FIELD OF ELECTRONIC COMPONENTS; CUSTOM DESIGN AND/OR TESTING ELECTRONIC COMPONENT PRODUCTS OF OTHERS; HIGH VOLTAGE TESTING