BLUELINE

Industrial adhesives, namely resin-based adhesives for attaching electronic components to circuit substrates, resin-based capillary underfill, resin-based no-flow underfill and resin-based water-level underfill, and electronic component packaging materials, namely resin-based transfer molding compound materials and resin-based encapsulant materials used to enclose or protect semiconductor devices, all for use in the manufacture of electronic component assemblies and radio frequency component assemblies

cleaning materials for use in removing flux residues from soldered assemblies

industrial and metal-based materials, namely laminates, solder, solder alloys, solder paste, solder flux and coated flux for use in the manufacture of electronic components assemblies and radio frequency component assemblies