BERGQUIST

HEAT MANAGEMENT COMPONENTS FOR INCORPORATION IN ELECTRONIC ASSEMBLIES AND PRINTED CIRCUIT BOARDS, namely, INSULATING HEAT SINK MOUNTS FITTED FOR ELECTRONIC COMPONENTS; SILICONE COATED ELECTRICAL INSULATIVE FILM FITTED FOR USE IN COMMERCIAL AND INDUSTRIAL ELECTRONIC INSTALLATIONS, SOLD IN THE FORM OF SHEETS AND SPECIAL SHAPES; [ MULTIFUNCTION ELECTRONIC MEMBRANE SWITCHES; ] MOUNTING PADS FITTED FOR SEMICONDUCTORS DEVICES; [ INSULATORY COATINGS OF PLASTIC RESIN SOLD AS A COMPONENT OF SEMICONDUCTORS FOR USE IN MANUFACTURING ELECTRONIC EQUIPMENT; ] MOUNTING SUBSTRATES FOR INCORPORATION IN ELECTRONIC COMPONENTS; [ ELECTRICAL MEMBRANE SWITCHES; ] AND ELECTRICAL INSULATIVE, THERMALLY CONDUCTIVE MOUNTING PADS FITTED FOR ELECTRONIC COMPONENTS