AXIC

x-ray fluorescence spectrometers for use in measurement of thickness and composition of coatings on semiconductors, magnetic hard disks, and thin film magnetic heads; ion mills for use in the fabrication of semiconductor devices, thin film magnetic heads, and optical polishing and coating; plasma equipment; namely, plasma ashers, plasma deposition devices, and reactive ion etchers for use in semiconductor fabrication, surface cleaning and modification, and printed circuit board manufacture; thin film deposition equipment; namely, vacuum evaporators, sputtering equipment and chemical vapor deposition devices for use in the semiconductor, printed circuit, optics, electron microscopy, and magnetics fields; semiconductor porduction equipment comprised of sputtering, vacuum evaporation, plasma processing, x-ray, and ion source devices; superconductor production equipment comprised of thin film measurement and sputtering devices; and magnetic film production equipment comprised of ion mills and x-ray fluorescence devices