ASSEMBLY TECHNOLOGIES

automatic epoxy die attach equipment used in the manufacture of microelectronic circuits, namely the bonding of microelectronic circuit chips to lead frames and the electro-optical inspection of the finished product, programmable dicing saws used in the manufacture of microelectronic circuits and other high precision devices

automatic epoxy die attach equipment used in the manufacture of microelectronic circuits, namely the bonding of microelectronic circuit chips to lead frames and the electro-optical inspection of the finished product, programmable dicing saws used in the manufacture of microelectronic circuits and other high precision devices

maintenance and repair services for automatic epoxy die attach equipment used in the manufacture of microelectronic circuits, namely the bonding of microelectronic circuit chips to lead frams and the electro-optical inspection of the finished product and programmable dicing saws used in the manufacture of microelectronic circuits and other high precision devices